Week In Review: Manufacturing, Test
Chipmakers and OEMs China has been working on compound semiconductors, such as gallium-nitride (GaN) and silicon carbide (SiC). Now, a China-backed company has taken a big step in the SiC and related...
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China Accelerates Foundry, Power Semi Efforts
China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide...
View ArticleInvestigation of integrated factors in the occurrence of copper wire bonding...
Abstract “Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper...
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Design And Security Challenges for VR
Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a...
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Equipment Suppliers Brace For GaN Market Explosion
A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage...
View ArticleWeek In Review: Semiconductor Manufacturing, Test
Chinese memory chip maker YMTC and dozens of other Chinese entities are “at risk” of being added to a trade blacklist as soon as Dec. 6, a U.S. Commerce Department official said in prepared remarks...
View ArticleWeek In Review: Design, Low Power
Synopsys acquired Silicon Frontline Technology, a provider of an electrical layout verification solution for mixed-signal and analog designs, large-scale power semiconductor devices, and electrostatic...
View ArticleChip Industry Week In Review
By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC,...
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Chip Industry Week In Review
By Jesse Allen, Karen Heyman, and Liz Allan Japan’s Rapidus and the University of Tokyo are teaming up with France’s Leti to meet its previously announced mass production goal of 2nm chips by 2027, and...
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Chip Industry Week In Review
The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The...
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